Notes - Material
Housing: high temperature thermoplastic
Contact: copper alloy
Shell: SUS (no plating)
Beg: copper alloy - Plating
Contact Area: gold plated over Ni
Solder Tall: 100u" min SN/ PB plated over Ni - Rating
Current Rating: 0.5a
Voltage Rating: 250vrms
Operating Temperature: -25°C ~ 90°C - Specification
Contact Resistance: 40 milliohms
Dielectric Withstanding Voltage: 500vac megohms
Insulation Resistance: 100 megohms
Insertion Force: 40n max
Separation Force: 0.98n min
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| XD Card Pin Design | | MS Card Pin Design |
| Pin | Name | Pin No. | Name | | 1# | CD | 11# | D1 | | 2# | R/-B | 12# | D2 | | 3# | /RE | 13# | D3 | | 4# | /CE | 14# | D4 | | 5# | CLE | 15# | D5 | | 6# | ALE | 16# | D6 | | 7# | /WE | 17# | D7 | | 8# | /WP | 18# | VCC | | 9# | GND | 19# | GND | | 10# | D0 | 20# | VCC |
| | | Pin No. | Name | | 1# | VSS | | 2# | BS | | 3# | VCC | | 4# | DIO | | 5# | Reserve | | 6# | INS | | 7# | Reserve | | 8# | SCLK | | 9# | VCC | | 10# | VSS |
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| SD CARD PIN DESIGN |
| Pin No. | Name | Description | | 1# | CD/DAT3 | Card detecd / Data I/O | | 2# | CMD | Command | | 3# | VSS1 | Ground | | 4# | VDD | Power | | 5# | CLK | Clock | | 6# | VSS2 | Ground | | 7# | DAT0 | Data I/O | | 8# | DAT1 | Data I/O | | 9# | DAT2 | Data I/O |
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 | DWN Kevin.ke
17-AUG-2005 | CHKSKY.HUAN
17-AUG-2005 |  | APVDJames.Chan
17-AUG-2005 |  |  |  |
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| XXX-400046-005 | 30u'' Gold | XXX-400046-004
| 15u'' Gold | | XXX-400046-003 | 10u'' Gold | | XXX-400046-002 | 5u'' Gold | | XXX-400046-001 | Gold Flash | | Part Number | Contact Plating |
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