Plating:
Contact:
ĄPUnderplating: 1.27μm(50u")min Nickel overall
ĄPContact Area: Gold Plating Over 1.27μm(50u") Nickel underplate. SEE NOTE(4)
ĄPSolder Tail: 2.54μm(100u")min. Sn/Pb over Ni underplate
Ped: 2.54μm(100u") min. Su/Pb over 1.27μm(50u") min. Ni underplate overall