Plating:
Contact:
ĄPUnderplating: 1.27μm (50u") min Nickel overall
ĄPContact Area: Gold Plating Over 1.27μm(50u") Nickel underplate. See note (4)
ĄPSolder Tail: 2.54μm (100u") min. Sn/Pb over Ni underplate
Ped: 2.54μm (100u") min. Su/Pb over 1.27μm(50u") min. Ni underplate overall